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Taiya TSG series thermal sealing adhesive is a two-component, 1:1 mixed, room temperature cured thermal sealing material used for gap filling and heat dissipation between BBU power module ternary cells and BMS board, with a thermal conductivity coefficient covering 0.5-4.0 W/(m · K).
Solution Overview
The interior of the BBU power module consists of ternary battery cells, and the increase in AI computing power leads to a continuous rise in heat generation. Excessive temperature difference between battery cells can trigger the temperature protection threshold and limit the overall available capacity. The Taiya TSG series thermal conductive sealing adhesive is used for sealing and heat dissipation of BBU modules. By filling the gaps between battery cells and the space under the BMS board, the heat is conducted to the surface of the shell and dissipated, reducing the temperature difference between battery cells.
1. Component A has been stored for a long time and the filling material has settled. It was taken out without sufficient mixing; 2. The surface of the substrate is affected by oil stains, release agents, and other factors that inhibit curing; 3. The ambient temperature is low, and the curing rate slows down significantly. Before use, it is necessary to stir the A adhesive up and down, clean the substrate, and extend the curing time appropriately in a low-temperature environment.
Bubbles are often brought into the air by stirring, colloidal sedimentation is not stirred evenly, environmental humidity is high, or solidification speed is too fast. It is recommended to stir the main agent thoroughly before use, and then perform vacuum defoaming after mixing; Preheat the components in advance, control the temperature and humidity of the curing environment, avoid rapid heating and curing, and reduce the generation of pores.
